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The Effect of Vacuum Reflow Processing On Solder Joint Voiding And Thermal Fatigue Reliability

Heller 公司 | http://hellerindustries.com.cn/Vacuum-Void-Reduction-Reflow.pdf

. The thermal cycling results are discussed in terms of the general impact of voiding on solder thermal fatigue reliability, results from the open literature, and the evolving industry standards for solder voiding

Heller 公司

Class 2 & Class 3 Inspection Standards in PCB Assembly | Imagineering

Imagineering, Inc. | https://www.pcbnet.com/blog/class-ii-vs-class-iii-inspection-standards-in-pcb-assembly/

. Today’s blog will cover this topic and help shed some light on this vital topic. Learn more about the classifications below. Class 2 and Class 3 Standards These are quality standards established by IPC-A-610 that were created to better define the rules for building electronic assemblies

Imagineering, Inc.

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